Get ready for one of the most anticipated events in advanced semiconductor packaging!

Announcing an IMAPS Executive Summit ~ September 24 and 25 

Advanced Packaging 2025: Market Momentum & Investment Outlook
Powering the Next Wave of Semiconductor Innovation

Organized by the IMAPS Silicon Valley Chapter  Hosted at Rapidus Corporation in Santa Clara, California

"This high-impact event will bring together leaders from across the ecosystem — investors, startups, analysts, industry experts and decision-makers — to explore how advanced packaging is redefining innovation and market leadership. I am grateful to be part of this initiative and looking forward to the discussions, insights, and connections that will help shape the future of semiconductors."  Co-Chair Rozalia Beica, Field CTO Packaging Technologies at Rapidus Design Solutions

Designed for senior executives and strategic stakeholders, the program offers:
◊ Actionable insights into emerging market dynamics and capital flows
◊ Expert perspectives on packaging’s evolving role in enabling next-gen solutions
◊ Curated networking with peers shaping the semiconductor landscape

Position your organization at the forefront of innovation and investment. 
Discover where advanced packaging is headed—and how to lead the way.

September 24 will cover Vision, Investment and Strategy
September 25 will focus on Innovations in 3D Chiplets, Photonics, and Agentic AI

Registration is open and sponsorships are available.

To learn more, visit the event page